page 1 formosa ms 1 2 2 2 2 3 4 5 5 6 7 7 8 list list................................................................................................. package outline............................................................................... features.......................................................................................... maximum ratings ............................................................................. electrical characteristics................................................................... rating and characteristic curves........................................................ pinning information........................................................................... suggested solder pad layout............................................................. packing information.......................................................................... reel packing.................................................................................... suggested thermal profiles for soldering processes............................. high reliability test capabilities........................................................... mechanical data............................................................................... mmbz5221b thru mmbz5270b zener diode http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. ds-221744 2009/08/10 2010/04/12 b 8
silicon epitaxial planar chip strucuction. wide zener reverse voltage range 2.4v to 91v. small package size for high density applications. ideally suited for automated assembly processes. lead-free parts meet environmental standards of mil-std-19500 /228 features ? ? ? ? ? ? ? ? 225 mw rating on frC4 or frC5 board. esd rating of class 3 (>16 kv) per human body model. suffix "-h" indicates halogen-free part, ex.mmbz5221b-h. package outline page 2 225mw surface mount zener diodes - 2.4v-91v parameter conditions symbol p d min. typ. max. 225 unit mw storage temperature operating temperature t stg t j -55 -65 +150 +175 o c o c maximum ratings (at t =25 c unless otherwise noted) a o power dissipation formosa ms zener diode http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 mechanical data ? ? ? ? ? ? epoxy:ul94-v0 rated flame retardant case : terminals : solder plated, solderable per mil-std-750, method 2026 polarity : indicated by cathode band mounting position : any molded plastic, sot-23 weight : approximated 0.008 gram document id issued date revised date revision page. mmbz5221b thru mmbz5270b thermal resistance o c/w junction to ambient r ja 556 v f 0.9 v forward voltage ds-221744 2009/08/10 2010/04/12 b 8 i =10ma f dimensions in inches and (millimeters) sot-23 0.035 (0.89) 0.051 (1.30) 0.063 (1.60) 0.047 (1.20) 0.108 (2.75) 0.083 (2.10) 0.027 (0.67) 0.013 (0.32) (a) (b) (c) 0.120 (3.04) 0.110 (2.80) .084(2.10) .068(1.70) 0.045 (1.15) 0.034 (0.85) 0.020 (0.50) 0.012 (0.30) 0.007 (0.18) 0.003 (0.09)
page 3 http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 formosa ms zener diode document id issued date revised date revision page. mmbz5221b thru mmbz5270b note: 1. zener voltage is measured with a pulse test current i at an ambient temperature of 25 c z ds-221744 2009/08/10 2010/04/12 b 8 mmbz5256b mmbz5257b mmbz5258b mmbz5259b mmbz5260b
page 4 http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. ds-221744 2009/08/10 2010/04/12 b 8 rating and characteristic curves (mmbz5221b thru mmbz5270b) ? vz ,(/) temperature coefficient mv c -3 -2 -1 0 1 2 3 4 5 6 7 8 2 3 4 5 6 7 8 9 10 11 12 10 100 100 10 1 1000 100 10 1 0 10 20 30 40 50 60 70 80 90 1000 100 10 1 0.1 0.01 0.001 0.0001 0.00001 typical t values for mmbz5221b series c typical t values for mmbz5221b series c 75 v (mmbz5267b) 91 v (mmbz5270b) figure 1 temperature coefficients temperature range 55c to 150c . (+) ? figure 2 temperature coefficients temperature range 55c to 150c . (+) ? figure 6. typical leakage current figure 5. typical capacitance vz, nominal zener voltage (v) vz, nominal zener voltage (v) 1 10 100 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 vz, nominal zener voltage (v) vf, forward voltage (v) vz, nominal zener voltage (v) vz, nominal zener voltage (v) vz, zener voltage (v) vz, zener voltage (v) =25c =25c =25c ? vz ,(/) temperature coefficient mv c c c c c 150 -
page 5 formosa ms zener diode http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 suggested solder pad layout dimensions in inches and (millimeters) document id issued date revised date revision page. (a) (b) (c) pinning information pina no connection pinb pinc anode cathode pin simplified outline symbol (a) (c) (b) mmbz5221b thru mmbz5270b sot-23 0.035(0.90) 0.031(0.80) 0.079(2.0) 0.037(0.95) 0.037(0.95) ds-221744 2009/08/10 2010/04/12 b 8
page 6 packing information formosa ms zener diode http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 p 0 p 1 e b d f w p a d d 1 d 2 w 1 c t document id issued date revised date revision page. mmbz5221b thru mmbz5270b item tolerance sot-23 carrier width carrier length carrier depth sprocket hole 13" reel outside diameter 7" reel outside diameter 13" reel inner diameter 7" reel inner diameter feed hole diameter sprocket hole position punch hole position punch hole pitch sprocket hole pitch embossment center reel width overall tape thickness tape width p 0 p 1 e b c d f t w p a d d d 1 d 1 d 2 w 1 symbol 0.1 0.1 0.1 min min 0.5 0.1 0.3 1.0 0.1 0.1 0.1 0.1 0.1 0.1 2.0 2.0 unit:mm 1.50 - 178.00 - 62.00 13.00 1.75 3.50 4.00 4.00 2.00 0.23 8.00 11.40 note:devices are packed in accor dance with eia standar rs-481-a and specifications listed above. 3.15 2.77 1.22 ds-221744 2009/08/10 2010/04/12 b 8
page 7 formosa ms zener diode http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. mmbz5221b thru mmbz5270b reel packing sot-23 3,000 4.0 30,000 183*183*123 178 382*262*387 240,000 11.6 package reel size reel component spacing box inner box reel dia, carton size carton approx. gross weight (kg) (pcs) (m/m) (m/m) (m/m) (pcs) (m/m) (pcs) 7" profile feature soldering condition average ramp-up rate(t to t ) <3 /sec preheat -temperature min(tsmin) 150 -temperature max(tsmax) 200 -time(min to max)(t ) 60~120sec tsmax to t -ramp-uprate <3 /sec time maintained above: -temperature(t ) 217 -time(t ) 60~260sec peak temperature(t ) 255 0/ 5 time within 5 of actual peak temperature(t ) ramp-down rate <6 /sec time 25 to peak temperature <6minutes lp s l l l p p o o o o o oo o o o c c c c c c- + c c c c 3.reflow soldering 10~30sec 1.storage environment: temperature=5 ~40 humidity=55%25% 2.reflow soldering of surface-mount devices oo cc suggested thermal profiles for soldering processes critical zone tl to tp critical zone tl to tp tl tsmax tsmin ramp-up tp ts preheat t25 c to peak o time 25 tl tp ramp-down temperature ds-221744 2009/08/10 2010/04/12 b 8
page 8 formosa ms zener diode http://www.formosams.com/ tel:886-2-22696661 fax:886-2-22696141 document id issued date revised date revision page. mmbz5221b thru mmbz5270b ds-221744 2009/08/10 2010/04/12 b 8 high reliability test capabilities 1. solder resistance 2. solderability 3. high temperature reverse bias 4. pressure cooker 5. temperature cycling 6. thermal shock 7. humidity 8. high temperature storage life at 260 5 for 10 2sec. immerse body into solder 1/16" 1/32" at 245 5 for 5 sec. v =80% rate at t =150 for 168 hrs. 15p at t =121 for 4 hrs. -55 to +125 dwelled for 30 min. and transferred for 5min. total 10 cycles. 0 for 5 min. rise to 100 for 5 min. total 10 cycles. at t =85 , rh=85% for 1000hrs. at 175 for 1000 hrs. c c c c cc cc c c o o o o oo oo o o rj sig a a mil-std-750d method-2031 mil-std-202f method-208 mil-std-750d method-1038 jesd22-a102 mil-std-750d method-1051 mil-std-750d method-1056 mil-std-750d method-1021 mil-std-750d method-1031 item test conditions reference
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